Press Release News By Category » semiconductors (302)
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Rising Threat of Terrorism Increase the EOD Equipments Market Demand Globally
EOD Equipment Market is driven by defense forces modernization programs, EOD Equipment Market grows as there are rising number of instances of terrorist attacks


congatec’s new COM Express modules with latest Intel Celeron processors, codenamed Skylake
congatec integrates today’s most cost efficient Intel Celeron processor with fast DDR4 SO-DIMM memory support


Barron Lighting Group Announces New Representative
Barron Lighting Group Announces New Virginia Lighting Representative


Cavium Unveils OCTEON TX™: Industry’s widest range of 64-bit ARM®-based SOCs
SOCs with 1 to 24 enhanced ARMv8.1 cores, rich ecosystem for control plane applications and hardware acceleration for data plane


Saint-Gobain to Participate in Upcoming SVC TechCon 2016 in

Saint-Gobain Ceramic Materials, Boron Nitride will participate at the 59th Annual Technical Conference, SVC TechCon 2016 in Indianapolis from May 9 - 13, 2016.


RFMicron Deploys Hermes IoT Smart Edge Platform For Battery-Free Smart Passive Sensors

Flexible, modular development platform enables cloud connectivity while delivering secure and reliable local processing data refinement


RFMicron Deploys Predictive Maintenance Kit for Wireless Temperature Monitoring

Ready-to-go kit delivers critical temperature monitoring for mechanical plants and motors using self-install and self-monitoring approach


Fun on Tap at DAC 2016: Stars of IP Party Returns to Austin
IPextreme rallies twenty co-host companies to celebrate semiconductor IP ecosystem, Texas style


Saint-Gobain Performance Plastics Introduces Flexible, Translucent Tubing for Milking Equipment

Saint-Gobain has expanded its Tygon® portfolio to include Tygon® II, a durable tubing product that helps to protect product integrity in milking applications.


Fast Emerging Markets of Mobile and Edge Computing Featured at Open Server Summit 2016
Learn how a combination of high-speed, low-latency interfaces, FPGAs, and low-cost, low-power servers will provide the infrastructure needed for mobile access.


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