Innodisk Unveils DDR4 Memory for Industrial Applications on Upcoming Skylake Platform

A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded

Online PR News – 24-March-2015 – Taipei – March 19, 2015, Taipei, Taiwan – Innodisk, the service driven flash and DRAM provider, is introducing DDR4 memory modules designed for industrial applications on Intel's upcoming Skylake platform. The new unbuffered long DIMM and compact SO-DIMM memory offerings will feature significantly lower power consumption and higher performance than comparable DDR3 modules and will have ECC error correction available for industrial and embedded applications. An extra thick 30u gold connector, on-board thermal sensors and conformal coatings make these JEDEC-compliant DDR4 modules especially suited for the next generation of industrial systems.

Better Embedded Performance
Operating at 2133Mhz, Innodisks’s DDR4 memory offers up to 30% better performance with 20% lower power consumption compared to current mainstream DDR3 SDRAM. With Intel Skylake projected to be the embedded platform of choice by the middle of 2015, Innodisk’s DDR4 memory modules will enable the next generation of embedded performance.

Thermal Sensors
Especially suited for fanless computers, on-board thermal sensors alert the system to temperature changes. This allows the monitoring of individual memory module temperatures to throttle performance and prevent overheating.

30u Golden Finger
Innodisk’s proprietary 30u Golden Finger connector interface is 10 times thicker than the JEDEC standard of 3u and ensures a reliable memory interface in industrial usage.

Conformal Coatings
Innodisk’s DDR4 memory has conformal coatings available to enhance reliability and service life in harsh industrial environments. Partnering with industry leader HumiSeal, Innodisk’s in-house production facility allows high quality application of protective coatings without risk of contamination or damage.

Features
Standard profile height of 30.0mm for SODIMM, and 31.25mm for UDIMM
ECC for data integrity
Single voltage
Significantly improved airflow
On-Die Termination using ODT pin
Lead-Free and compliant with RoHS
Average refresh period of 7.8us at 85°C or lower, and 3.9us between 85°C and 95°C

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Contact Information
Dan Zhang
Innodisk
5F., No. 237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City 221, Taiwan
Taipei

+886-2-7703-3000